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| URN: | http://URN.fi/URN:NBN:fi:tty-200907103178 |
| Title: | Evaluation of lead - free solder pastes |
| Author: | Grandi, Giovanni |
| Publication type: | Diplomityö |
| Issue date: | 2000-02-09 |
| University: | Tampereen teknillinen korkeakoulu |
| Faculty: | Materiaalitekniikan osasto |
| Department: | Materiaaliopin laitos, elektronimikroskopia |
| Abstract: | In the work 17 lead-free solder pastes are evaluated under two aspects: wetting capability and shear stress endurance. |