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Abstract:
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Flip chip attachment offers an intruiging way to miniaturise the functions in the electronic assembly. As the current development of electronic products is towards smaller size with ever-increasing functionality, flip chip attachment seems to prove its use. To attach a flip chip solders or conductive adhesives can be used. Even though the solder attachment has been introduced almost 40 years ago, there are still factors to be considered, when such application is taken into production line. Design and production are presented with tolerances much higher than before, as well as the equipment may bring other challenges. Also cost-consideration is underlined in modern production, which brings more points to the work of implementing a reliable flip chip solder attachment with adequate functionality. The material selection emphasis is on widely available materials and avoiding too complex structural solutions, as it is a way to lower the costs of production. The flip chip attachment should not be implemented to production just for the technology being available. A true need for the implementation should be present. |