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Reliability Studies of Flexible Polyimide Substrates with Flip-Chip Attachments and Electrical Test Structures 

Najari, Masoud (2015-12-09)
Miniaturization of modern electronic devices has greatly increased the demand for advanced substrates for high-density applications, fine pitch attachment processes, and high-speed applications. Flexible polyimide (PI) ...

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Najari, Masoud (1)
Date Issued2015 (1)

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